| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive radiation-sensitive resin composition of which a first resist pattern is insolubilized to form an insolubilized resist pattern having sufficient stability to subsequent exposure, a developer and a second positive radiation-sensitive resin composition. <P>SOLUTION: The positive radiation-sensitive resin composition contains a resin containing 5-65 mol% of a specific repeating unit and having an acid-dissociable group, and is used in step (1) of a resist pattern forming method including the steps of: (1) forming a first resist pattern; (2) applying a resist pattern insolubilizing resin composition on the first resist pattern to convert the first resist pattern to an insolubilized resist pattern; (3) forming a second resist layer on the insolubilized resist pattern and selectively exposing it; and (4) forming a second resist pattern. <P>COPYRIGHT: (C)2010,JPO&INPIT |
