发明名称 |
RESIN PACKAGE AND PRODUCTION METHOD THEREOF |
摘要 |
The method for producing a resin package according to the present invention includes a step of forming a copper oxide layer by oxidizing the surface of a lead frame in which at least the surface is made of copper, and a step of forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame surface by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution. |
申请公布号 |
US2010072433(A1) |
申请公布日期 |
2010.03.25 |
申请号 |
US20090406997 |
申请日期 |
2009.03.19 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
MAEDA MITSUO;MATSUMI YASUO |
分类号 |
H01B1/22 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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