| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed is a semiconductor device having excellent heat resistance, wherein a semiconductor element and an object to be bonded are bonded together through a patterned film-like photosensitive adhesive by means of thermal compression bonding. In the semiconductor device, the water content in the patterned film-like photosensitive adhesive right before the thermal compression bonding is not more than 1.0% by weight. |
| 申请公布号 |
WO2010032529(A1) |
申请公布日期 |
2010.03.25 |
| 申请号 |
WO2009JP61596 |
申请日期 |
2009.06.25 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD.;KAWAMORI TAKASHI;MITSUKURA KAZUYUKI;MASUKO TAKASHI;KATOGI SHIGEKI |
发明人 |
KAWAMORI TAKASHI;MITSUKURA KAZUYUKI;MASUKO TAKASHI;KATOGI SHIGEKI |
| 分类号 |
H01L21/52;C09J4/00;C09J7/00;C09J11/06;C09J163/00;C09J179/04;C09J201/00 |
主分类号 |
H01L21/52 |
| 代理机构 |
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