| 摘要 |
PROBLEM TO BE SOLVED: To provide an ingot grinder that cuts out a large number of wafer sheets at a time without causing chipping in an ingot during the grinding while significantly reducing a grinding allowance when grinding the ingot to be thin. SOLUTION: The ingot grinder 1 grinds a silicon ingot 81 so as to obtain sheetlike silicon wafers 82 from the silicon ingot. The device includes: band saws 2 respectively formed so as to have single hardness along in the grinding direction; a holding body 3 for holding the plurality of band saws 2 in a parallel state; a drive mechanism 4 for reciprocating the band saws 2 with respect to the silicon ingot 81 by using the holding body 3; and a supply mechanism 6 for supplying slurry 72 containing abrasive grains 71 to a grinding part of the silicon ingot 81 when moving the band saws 2 by the drive mechanism 4. COPYRIGHT: (C)2010,JPO&INPIT |
