发明名称 METHOD FOR DETERMINATION OF THIOCKNESS OF SURFACE MICRO-DEFECT LAYER ON SILICON PLATES
摘要 Method for determination of thickness of surface micro-defect layer of silicon plates relates to technology for production of semiconductor devices. The utility model can be used at enterprises of micro-electronics profile for contact-less and non-destructive control of thickness of surface micro-relief layer on silicon plates used for production of semiconductor devices.
申请公布号 UA48502(U) 申请公布日期 2010.03.25
申请号 UA20090008343U 申请日期 2009.08.07
申请人 TARAS SHEVCHENKO KYIV NATIONAL UNIVERSITY 发明人 LYSOCHENKO SERHII VASYLIOVYCH;YEREMENKO VADYM OLEKSIIOVYCH;ZHARKYKH YURII SERAFYMOVYCH;KARPLIUK OLEKSANDR IVANOVYCH;PRYMACHENKO IVAN ANDRIIOVYCH;TRETIAK OLEH VASYLIOVYCH
分类号 G01B11/30 主分类号 G01B11/30
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