发明名称 |
Apparatus, Method and Computer Program Product for Fast Stimulation of Manufacturing Effects During Integrated Circuit Design |
摘要 |
Methods, apparatus and computer program products provide a fast and accurate model for simulating the effects of chemical mechanical polishing (CMP) steps during fabrication of an integrated circuit by generating a design of an integrated circuit; while generating the design of the integrated circuit, using a simplified model to predict at least one physical characteristic of the integrated circuit which results from a CMP processing step to be used during manufacture of the integrated circuit, wherein the simplified model is derived from simulations performed prior to the design generation activities using a comprehensive simulation program used to model the physical characteristic; predicting performance of the integrated circuit using the predicted physical characteristic; and adjusting the design of the integrated circuit in dependence on the performance prediction.
|
申请公布号 |
US2010077372(A1) |
申请公布日期 |
2010.03.25 |
申请号 |
US20080237727 |
申请日期 |
2008.09.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
XIANG HUA;ECONOMIKOS LAERTIS;FAYAZ MOHAMMED F.;GRECO STEPHEN E.;O'NEIL PATRICIA A.;PURI RUCHIR |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|