发明名称 Microplasma deposition apparatus and methods
摘要 <p>Microspray apparatus and methods involve injecting powdered material into a plasma gas stream (21). The material comprises first and second component powders. The second powder is a majority by the weight of the powdered material. The first powder acts as a melting point depressant. The first and second powders may have similar compositions but with the first powder including a greater quantity of a melting point depressant element.</p>
申请公布号 EP1743951(A3) 申请公布日期 2010.03.24
申请号 EP20060252223 申请日期 2006.04.25
申请人 UNITED TECHNOLOGIES CORPORATION 发明人 BLANKENSHIP, DONN R.;RUTZ, DAVID A.;PIETRUSCA, NORMAN A.;ZAJCHOWSKI, PAUL H.;SHUBERT, GARY
分类号 C23C4/12;F01D5/00;H05H1/42 主分类号 C23C4/12
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