| 摘要 |
<p>A cover tape for packaging electronic components that causes no contamination of sealing bar by the outflow of cushion layer and attains superior adhesion characteristic with the carrier tape is provided. A cover tape for packaging electronic components heat-sealable to a carrier tape for packaging electronic components, comprising
at least a base layer, a cushion layer formed of resin A, a heat-seal following layer formed of resin B and a heat-sealing layer laminated in this order; wherein Vicat softening temperature Ta of said resin A measured in accordance with ISO 306 (rate of temperature increase:50°C/hour, load: 10N) and Vicat softening temperature Tb of said resin B measured in accordance with ISO 306 (rate of temperature increase:50°C/hour, load: 10N)satisfy the Relational Expression 1 below; and
thickness of said heat-seal following layer is not smaller than 2 µm and not larger than 15 µm:
Relational Expression 1: Ta - Tb ‰¥ 3(°C).</p> |
