发明名称 |
Integrated circuit package system employing structural support |
摘要 |
An integrated circuit package system that includes: providing an electrical interconnect system including a support structure and a lead-finger system; stacking a first device over the support structure; stacking a second device over the first device; connecting the first device and the second device to the lead-finger system; stacking a dummy device over the second device; and exposing a support structure bottom side and a dummy device top side for thermal dissipation.
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申请公布号 |
US7683467(B2) |
申请公布日期 |
2010.03.23 |
申请号 |
US20060635941 |
申请日期 |
2006.12.07 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
JANG BYOUNG WOOK;KIM YOUNG CHEOL;LEE KOO HONG |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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