发明名称 |
Substrate treatment method and substrate treatment apparatus |
摘要 |
A substrate treatment method is disclosed, which can effectively reduce the amount of charges accumulated on a substrate due to treatment of the substrate with a water-containing liquid. The method comprises the steps of: supplying a water-containing liquid to a substrate held generally horizontally by a substrate holding/rotating mechanism while rotating the substrate at a first rotation speed; and removing charges from the substrate after the water supplying step by performing a puddle process for a predetermined period by retaining a liquid film of a predetermined liquid on a surface of the substrate held generally horizontally by the substrate holding/rotating mechanism with the substrate being rotated at a second rotation speed lower than the first rotation speed or kept in a non-rotating state without further supplying the predetermined liquid to the liquid film.
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申请公布号 |
US7682456(B2) |
申请公布日期 |
2010.03.23 |
申请号 |
US20050272600 |
申请日期 |
2005.11.11 |
申请人 |
DAINIPPON SCREEN MFG. CO., LTD. |
发明人 |
HASHIZUME AKIO |
分类号 |
B08B3/12;B08B6/00;C25F1/00;C25F3/30 |
主分类号 |
B08B3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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