用于握持、加热半导体晶圆或类似物之装置的轴部,申请号TW097304967-传众专利搜索

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发明名称	用于握持、加热半导体晶圆或类似物之装置的轴部
摘要
申请公布号	TWD133940	申请公布日期	2010.03.21
申请号	TW097304967	申请日期	2008.08.28
申请人	碍子股份有限公司	发明人	中村太一
分类号	15-99	主分类号	15-99
代理机构		代理人	洪澄文
主权项
地址	日本

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