| 摘要 |
PROBLEM TO BE SOLVED: To improve the efficiency of cooling in a semiconductor device of double-sided heat dissipation type. SOLUTION: A semiconductor device has a semiconductor element 1, a pair of metal plates 2, 3 which are electrically and thermally joined to each of a surface side and a backside of the semiconductor element 1 and hold the semiconductor element 1 therebetween and a first cooler 9 thermally joined to heat dissipation surfaces 2b, 3b, which are opposite surfaces of the semiconductor element 1 in the pair of metal plates 2, 3. In the semiconductor device, a second cooler 11 is interposed between the pair of metal plates 2, 3. The second cooler 11 is thermally connected to inner surfaces 2a, 3a, which are surfaces in the semiconductor element 1 side in the pair of metal plates 2, 3 and cools the pair of metal plates 2, 3. COPYRIGHT: (C)2010,JPO&INPIT |
