发明名称 LED PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED (Light Emitting Diode) package which is provided with many radially protruding heat discharge fins on the outer peripheral surface of a heat discharge body and has a maximized heat discharge effect. <P>SOLUTION: The LED package includes: the heat discharge body 110 provided with many radially protruding heat discharge fins 113 on the outer peripheral surface and molding material filled spaces 115 between the heat discharge fins 113; a package body 120 which is attached to the top surface of the heat discharge body 110 and has a cavity 123; a pair of lead frames 130 extended from upper parts of the heat discharge body 110 to both sides thereof; and an LED chip 140 mounted inside the cavity 123. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010062509(A) 申请公布日期 2010.03.18
申请号 JP20080278485 申请日期 2008.10.29
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM HYUNG KUN;PAEK HO SUN;JUNG SUK HO;KIM HAK HWAN;LEE YOUNG JIN
分类号 H01L33/48 主分类号 H01L33/48
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