发明名称 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 A printed wiring board comprises ground layers stacked via insulator(s); a first through hole; second through holes formed at predetermined positions along a circle concentric with a center axis of the first through hole; clearances provided between the first through hole and each of the ground layers; and signal wirings each extending from the first through hole through the clearance between predetermined ones of the ground layers, disposed between predetermined second through holes of the second through holes. Each of first clearances in the ground layers neighboring layer in which the signal wiring is disposed has an outline that a distance between the first through hole and outline of the first clearance is minimum of the signal wiring. Each of second clearances in the ground layers not adjacent to the signal wiring has an outline formed outside a circle connecting each center of second through holes centering the first signal through hole, such that outline of second clearance docs not contact with the second through holes. The second through holes arc not connected to the ground layers that are not adjacent to the signal wiring but are connected to the ground layer neighboring layer in which the signal wiring is disposed.
申请公布号 US2010065321(A1) 申请公布日期 2010.03.18
申请号 US20090557371 申请日期 2009.09.10
申请人 KASHIWAKURA KAZUHIRO 发明人 KASHIWAKURA KAZUHIRO
分类号 H05K1/11;H05K3/10 主分类号 H05K1/11
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