<p>A method of fabricating an organic device is provided. An electrically- insulating layer (312) is grown over a first surface of a flexible conductive substrate (311). The flexible conductive substrate (311) is then placed on an electrode (313) of a deposition chamber (400), such that the electrically insulating layer (312) is in contact with the electrode (313) and prevents electrical contact between the electrode (313) and the flexible conductive substrate (311). A layer is deposited by a plasma process over the substrate (311) while the electrically insulating layer (312) is in contact with the electrode (313) of the deposition chamber (400).</p>
