发明名称 |
PIEZOELECTRIC VIBRATION PIECE, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATION PIECE, PIEZOELECTRIC DEVICE, AND METHOD OF MANUFACTURING PIEZOELECTRIC DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of obtaining crystal vibration pieces by separating the crystal vibration pieces from a crystal vibration wafer by breaking a connection portion connecting the crystal wafer and respective crystal vibration pieces, a part of the connection portion being prevented from being left as breakage waste on a crystal vibration piece. <P>SOLUTION: Since the connection portion 2 is formed in contact with two notch portions 12 on either one of a top surface 1A or a reverse surface 1B of the crystal vibration piece 1, the top surface 1A of the crystal vibration piece 1 and the connection portion 2, and the reverse surface 1B and the connection portion 2 are connected in mutually different states, and then the breaking state of the connection portion 2 varies depending on directions in which a load is applied to the crystal vibration piece 1. Consequently, the broken connection portion 2 is prevented from being left on the crystal vibration piece 1 which has been separated from the crystal wafer. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010062794(A) |
申请公布日期 |
2010.03.18 |
申请号 |
JP20080225604 |
申请日期 |
2008.09.03 |
申请人 |
EPSON TOYOCOM CORP |
发明人 |
KOMINE KENJI;FUJIWARA YOSHITAKA |
分类号 |
H03H3/02;H01L41/09;H01L41/18;H01L41/22;H01L41/23;H01L41/338;H03H9/10 |
主分类号 |
H03H3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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