发明名称 COMPOSITE WOVEN FABRIC AND PRINTED WIRING BOARD
摘要 Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 μm or more and 16 μm or less, and the composite woven fabric has a thickness of 200 μm or less.
申请公布号 US2010065316(A1) 申请公布日期 2010.03.18
申请号 US20070447653 申请日期 2007.11.07
申请人 SHIN-ETSU QUARTZ PRODUCTS, LTD. 发明人 SATO AKIRA;FUJINOKI AKIRA;NISHIMURA HIROYUKU;SAKAGUCHI TSUKASA
分类号 H05K1/02;B32B5/00;D03D15/00 主分类号 H05K1/02
代理机构 代理人
主权项
地址