| 摘要 |
Provided is an anisotropic conductive film having enhanced adhesion strength to a circuit member and attaining high conduction reliability; a joined structure; and a method for producing the joined structure An anisotropic conductive film which electrically connects a first circuit member with a second circuit member having a nitrogen atom-containing film on a surface thereof facing the first circuit member, the anisotropic conductive film including a first layer which is to be located at a first circuit member side, and a second layer which is to be located at a second circuit member side, wherein the first layer comprises a cationic curing agent and a first thermosetting resin, and the second layer comprises a radical curing agent and a second thermosetting resin, and wherein at least one of the first and second layers comprises conductive particles, and the difference in maximum exothermic peak temperature between the first and second layers is within the range up to 20° C.
|
