| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide technique for improving heat dissipation of a circuit board. Ž<P>SOLUTION: The circuit board 10 for mounting a surface-mounted component 91 has a copper post 31 for dissipating heat of the surface-mounted component 91 along the thickness of the circuit board 10. The copper post 31 connects through a blind via 71a plated with copper, with a wiring pattern 121 formed of a copper foil plated with copper as well. Then the surface-mounted component 91 is attached to the wiring pattern 121 through copper paste 131. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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