发明名称 |
Method of manufacturing electronic component package |
摘要 |
An electronic component package includes: a main body including a plurality of layer portions that are stacked and that have their respective side surfaces, the main body having a side surface including the side surfaces of the layer portions; and wiring disposed on the side surface of the main body. Each of the layer portions has at least one electronic component chip and a plurality of electrodes disposed on the side surface of the layer portion. A method of manufacturing the electronic component package includes the steps of: fabricating a main body aggregate including a plurality of pre-main-body portions each of which is to become the main body later, the pre-main-body portions being arranged in one direction orthogonal to the direction of stacking of the plurality of layer portions; forming the wiring for each of the pre-main-body portions of the main body aggregate; and cutting the main body aggregate after the formation of the wiring so as to separate the plurality of pre-main-body portions from each other so that each of them becomes the main body and a plurality of electronic component packages are thereby formed.
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申请公布号 |
US7676912(B2) |
申请公布日期 |
2010.03.16 |
申请号 |
US20070896709 |
申请日期 |
2007.09.05 |
申请人 |
HEADWAY TECHNOLOGIES, INC.;SAE MAGNETICS (H.K.) LTD. |
发明人 |
SASAKI YOSHITAKA;SHIMIZU TATSUSHI |
分类号 |
H05K3/36 |
主分类号 |
H05K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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