发明名称 |
Method and system for extracting heat from electrical components |
摘要 |
A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.
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申请公布号 |
US7679916(B2) |
申请公布日期 |
2010.03.16 |
申请号 |
US20060608384 |
申请日期 |
2006.12.08 |
申请人 |
GE INTELLIGENT PLATFORMS EMBEDDED SYSTEMS, INC. |
发明人 |
ORR CHRIS ERWIN;SLATON DAVID S. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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