| 摘要 |
In an electronic component built-in substrate of the present invention, an electronic component is mounted on a mounted body having a first wiring layer, the electronic component is embedded in an insulating layer, a conductive ball is arranged to pass through the insulating layer and connected electrically to the first wiring layer, a second wiring layer connected electrically to the conductive ball is formed on the insulating layer, and the first wiring layer and the second wiring layer are interlayer-connected via the conductive ball.
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