| 摘要 |
An improved arrangement and process for packaging integrated circuits are described. More particularly, a universal lamination tool is described that functions to secure an adhesive film to a lead frame. The lamination tool of the present invention uses compressed gas to press the lead frame against the adhesive film. In this manner, the lamination tool itself does not physically press on the lead frame thereby substantially reducing the likelihood of damage to the bonding wires or other delicate components during this stage of the encapsulation process. Moreover, such a lamination tool is not package specific making it applicable for a wide variety of package configurations and lead frame sizes.
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