| 摘要 |
<p>PURPOSE: A film for manufacturing a semiconductor package and the semiconductor package using the same are provided to prevent a crack on the edge of an upper semiconductor chip by preventing an over-hang structure of the upper semiconductor chip. CONSTITUTION: A film body(204) has a plate shape and a plurality of penetration holes along the edges. Penetration electrodes(202) are filled in penetration holes respectively. A connection wiring is arranged inside the film body and electrically connects at least two penetration electrodes.</p> |
