| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the occurrence of curvature when manufacturing a printed circuit board having a configuration of odd layers, such as 3 layers, 5 layers and so on. <P>SOLUTION: In a method of manufacturing a printed circuit board having at least three layers of circuit wiring, a core substrate 100 having first copper foil layers 120 and 130 on both surfaces of a base 110 is used as a substrate for formation of inner layer circuit wiring, and one surface of the core substrate 100 is subjected to wiring formation processing to form prescribed inner layer circuit wiring 120a formed of the first copper foil layer, and second copper foil layers 150 and 160 for formation of outer layer circuit wiring are laminated on both surfaces of the core substrate 100 with prepreg layers 141 and 142 therebetween after the first copper foil layer 130 is removed from all the other surface of the core substrate 100 by etching, and the second copper foil layers 150 and 160 are subjected to wiring formation processing to form outer layer circuit wiring 150a and 160a. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
