| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device inspecting method more accurately determining the quality of an IC chip. SOLUTION: The method includes a wiring inspecting step of detecting a disconnection failure of wiring in the IC chip. The wiring inspecting step includes steps (steps (S) 3 to 7) of starting a functional test on a circuit including an inspected part to set the inspected part in a charge supplied state, irradiating the charge-supplied inspected part with light and outputting a result of the functional test after the inspected part is irradiated with the light for a predetermined time. According to this method, a malfunction caused by disconnection is made more liable to occur than would be possible in case of no irradiation of the inspected part with light and the sensitivity to detection of a disconnection failure can be increased. COPYRIGHT: (C)2010,JPO&INPIT |
