| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a process monitoring method measuring a physical change of a semiconductor wafer observed before and after each semiconductor manufacturing process. Ž<P>SOLUTION: In monitoring, a measuring cassette into which a mass meter for measuring the mass of a wafer to be processed is incorporated is prepared and attached to first load ports 2a to 2c. Wafer carrier containers 3a, 3c with semiconductor wafers housed therein are attached to adjacent second load ports 2a to 2c. The semiconductor wafer housed in the wafer carrier container is transferred into the measuring cassette, the mass of the wafer is measured and first measurement data is transmitted to a signal processing means 6 disposed outside of the cassette. At the completion of a process, the processed wafer is housed in the cassette. The mass of the wafer after processed is measured by the mass meter and measured second measurement data is transmitted to the signal processing means 6. A change in physical quantity of the wafer before and after processed is calculated using the first and second measurement data. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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