| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component package having a plurality of electronic components packaged, wherein the yield is improved, and to provide a method of manufacturing the electronic component package. SOLUTION: In the electronic component package 10 having a plurality of electronic components 11 and a casing 13 formed by bonding a plurality of structural components so that the plurality of electronic components are covered, functional surfaces 11a, 11b of the electronic components and a bonding surface 21b between the structural components of the casing are disposed crossing each other, the functional surfaces of the electronic components and a packaging surface 20a of the casing for the electronic components are disposed crossing each other, and a wire 17 for electrically connecting the plurality of electronic components to each other is formed in a surface parallel to the bonding surface. COPYRIGHT: (C)2010,JPO&INPIT |
