发明名称 SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method that process a substrate with a processing liquid reduced in oxygen concentration. SOLUTION: The substrate processing apparatus 1 includes a spin chuck 3 for holding the substrate W, a blocking plate 6 which has a substrate opposite surface 34 opposed to the substrate W held by the spin chuck 3 and also has a peripheral wall portion 32 formed protruding from the periphery of the substrate opposite surface 34 toward the spin chuck 3, and a first upper processing liquid supply pipe 35 for supplying the processing liquid to the substrate W held by the spin chuck 3. Chemicals are supplied to the first upper processing liquid supply pipe 35 from a first in-piping-blending unit 51 through a second upper processing liquid supply pipe 38. The chemicals are blended by mixing, in a first mixing unit 59, the undiluted solution of chemicals with inert-gas dissolved water produced by removing oxygen in pure water and adding an inert gas into the pure water by an inert-gas dissolved water producing unit 50. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010056218(A) 申请公布日期 2010.03.11
申请号 JP20080218221 申请日期 2008.08.27
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 HASHIZUME AKIO;MIYAJI NOBUYUKI
分类号 H01L21/304;B08B3/02;B08B3/08;G02F1/13;G02F1/1333;H01L21/027 主分类号 H01L21/304
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