| 摘要 |
PROBLEM TO BE SOLVED: To provide a joining apparatus and method for joining without damaging members to be joined with a laser beam when soldering is performed using a laser beam. SOLUTION: A first member 102 is irradiated with a laser beam of a low energy level by which solder 103 is unfused, by using a laser irradiation device 150. On the basis of measurement results of temperature measuring instruments 120A, 120B, a normal/defective condition is discriminated on the abutting state of the first and second members 102, 100. If the abutment is discriminated as satisfactory, the first member 102 is irradiated with a laser beam of a high energy level by which the solder 103 is fused, thereby joining the first and second members 102, 100. COPYRIGHT: (C)2010,JPO&INPIT |
