| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition whose cured material has a good surface non-tackiness, which is transparent and excellent in light resistance and thermal yellowing resistance, and which can be used for applications having severe requirements, such as sealing of light emission devices for a short wavelength region and a high output. SOLUTION: The thermosetting resin composition comprises a component (A) and a component (B) shown below, and has a content ratio of both the components of (A):(B)=20:80 to 80:20 in terms of mass. The component (A): an epoxy group-containing acrylic copolymer comprising a constitution unit having an alkoxysilyl group as unit 1, a constitution unit having an epoxy group as unit 2, and a constitution unit having a polydimethylsiloxane structure as unit 3. The component (B): a hemiacetal ester bond-containing acrylic copolymer comprising a constitution unit having an alkoxysilyl group as unit 1, a constitution unit having a hemiacetal ester bond as unit 4, and a constitution unit having a polydimethylsiloxane structure as unit 3. COPYRIGHT: (C)2010,JPO&INPIT
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