发明名称 |
SENSITIZING SOLUTION FOR ELECTROLESS PLATING, AND ELECTROLESS PLATING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a sensitizing solution for electroless plating, which can easily dissolve an Sn compound therein without using an acid and can be used for a long period of time without impairing the uniformity of the metal-plated film. SOLUTION: The sensitizing solution for electroless plating includes the Sn compound and a solvent. The solvent includes 10 vol.% or more of a water-soluble alcohol. An electroless plating method includes a pretreatment step of immersing an article to be plated into a pretreatment solution, and a plating step of immersing the article to be plated after having been pretreated into a plating solution. The sensitizing solution for the electroless plating is used as the pretreatment solution. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010053435(A) |
申请公布日期 |
2010.03.11 |
申请号 |
JP20080222819 |
申请日期 |
2008.08.29 |
申请人 |
SHOWA DENKO KK;KANTO GAKUIN |
发明人 |
KOIWA ICHIRO;KANEDA RYUMA;HASHIMOTO AKIRA;USUDA MASAHIKO |
分类号 |
C23C18/30;H01L21/28;H01L21/288;H05K3/18 |
主分类号 |
C23C18/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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