发明名称 SENSITIZING SOLUTION FOR ELECTROLESS PLATING, AND ELECTROLESS PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a sensitizing solution for electroless plating, which can easily dissolve an Sn compound therein without using an acid and can be used for a long period of time without impairing the uniformity of the metal-plated film. SOLUTION: The sensitizing solution for electroless plating includes the Sn compound and a solvent. The solvent includes 10 vol.% or more of a water-soluble alcohol. An electroless plating method includes a pretreatment step of immersing an article to be plated into a pretreatment solution, and a plating step of immersing the article to be plated after having been pretreated into a plating solution. The sensitizing solution for the electroless plating is used as the pretreatment solution. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010053435(A) 申请公布日期 2010.03.11
申请号 JP20080222819 申请日期 2008.08.29
申请人 SHOWA DENKO KK;KANTO GAKUIN 发明人 KOIWA ICHIRO;KANEDA RYUMA;HASHIMOTO AKIRA;USUDA MASAHIKO
分类号 C23C18/30;H01L21/28;H01L21/288;H05K3/18 主分类号 C23C18/30
代理机构 代理人
主权项
地址