发明名称 EPOXY RESIN COMPOSITION AND MATERIAL FOR FLEXIBLE PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition allowing resin crack and powder fall to be reduced by lowering modulus of elasticity at room temperature without lowering Tg significantly. Ž<P>SOLUTION: The epoxy resin composition includes (A) an epoxy resin, (B) an epoxy resin curing agent, (C) a carbodiimide-modified soluble polyamide, and (D) a flame retardant, wherein (D) a flame retardant contains a specified liquid phosphazene having six substituents, two to four of which are substituted with a phenoxy group with a methyl substituent. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010053189(A) 申请公布日期 2010.03.11
申请号 JP20080217365 申请日期 2008.08.26
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 ISHIKAWA YOSUKE;KOSEKI TAKAYOSHI;OKUNO SHINJI;EZAKI YOSHIAKI
分类号 C08G59/40;C08G69/48;C08L63/00;C08L77/00;H05K1/03 主分类号 C08G59/40
代理机构 代理人
主权项
地址