LIQUID FOR PROTECTING COPPER WIRING SURFACE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CIRCUIT ELEMENT

摘要

Disclosed is a liquid for protecting a copper wiring material surface that is used in the production of a semiconductor circuit element including copper wiring and comprises an aqueous solvent and acetylene alcohols including at least 3-phenyl-2-propyn-1-ol.  Also disclosed is a method for manufacturing a semiconductor circuit element, comprising forming an insulating film and/or a diffusion preventive film on a silicon substrate, then forming a copper film by sputtering, further forming a copper film or a copper alloy film containing not less than 80% by mass of copper by plating on the copper film, and then flattening the assembly by chemical mechanical polishing (CMP) to form a semiconductor substrate including copper wiring.  In the method, the semiconductor substrate having an exposed copper wiring material surface is subjected to liquid contact treatment with the liquid for protecting a copper wiring material surface.