Sputtering target comprises a carrier body, and a sputtering material, which is fixed by a connection layer on the carrier body, where the connection layer consists of inorganic oxide and/or silicate as main component of its binder phase

摘要

The sputtering target comprises a carrier body, and a sputtering material, which is fixed by a connection layer on the carrier body. The connection layer consists of inorganic oxide and/or silicate as main component of its binder phase, and contains electric- and/or heat conductive particles and/or fibers. The carrier body and the sputtering material are bonded with one another by an electric conductive- and/or heat conductive body.