| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing composition with which a polyimide film is polished in a short period of time by chemical-mechanical polishing while high flatness is maintained and production of a polishing scratch is suppressed, and to provide a polishing method using the same. <P>SOLUTION: The polishing composition is used for the chemical-mechanical polishing of the polyimide film, and contains at least abrasive grains and water and has pH of≤5. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
