| 摘要 |
The present invention provides a stack assembly comprising at least one semiconductor device 2a-2d, preferably having an open construction, interspersed between heatsinks 20a-20e and adapted to be at least partially immersed in a liquid dielectric coolant. The open construction means that the at least one semiconductor device 2a-2d will be immersed and flooded in the liquid dielectric coolant. In other words, any spaces or gaps between the various component parts of the at least one semiconductor device 2a-2d will be filled with the liquid dielectric coolant to provide a suitable dielectric environment.
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