| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure capable of reducing crosstalk noise between signals without decreasing the thickness of a double-layer type printed wiring board while reducing the size of the double-layer type printed wiring board. Ž<P>SOLUTION: A line of ground potential is provided on both sides of a signal line 5 wired on the upper surface of the double-layer type printed wiring board. At least at the start and end of the line of ground potential, a through-hole 3 is provided for connection to a plane of ground potential wired on the lower surface of the double-layer type printed wiring board. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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