| 摘要 |
PURPOSE: A semiconductor package insert is provided to install a hook unit on both sides of a package insert and to form a pocket fixing unit on both sides of a pocket in order to enable a worker to easily combine the package insert and the pocket, thereby simplifying working processes and reducing product costs. CONSTITUTION: A forming method for a semiconductor package insert comprises the following steps: forming a hook sub installation hole with a hinge groove on both sides of a package insert(100) across a package accepting groove(110); installing a hook unit(300) with a hanger loop(320) on a hinge pin(310) which is inserted into the hinge groove of the hook sub installation hole through the tension of a torsion spring(350); forming a pocket fixing unit in which a hanger loop hole and a hanging unit is included; combining a pocket and a package insert detachably. |
