| 摘要 |
PURPOSE: A heat treatment apparatus, a heat treatment method and a storage medium are provided to simultaneously perform heat treatment to a plurality of wafers by loading the wafers on a wafer boat of a rack shape and transferring the wafers to a heat treatment furnace. CONSTITUTION: A normal height position of a ring unit(38) is obtained by relatively elevating and lowering a transfer base unit(5) with respect to a wafer boat(3) when the wafer boat is not subjected to a heat treatment. A height position of the corresponding ring unit is obtained before a wafer(W), which is not heat-treatmented, is transferred to the wafer boat. Whether to transfer the wafer to the wafer boat can be verified by comparing a difference between the normal height position of the ring unit and the height position the ring unit before the wafer is transferred.
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