| 摘要 |
PURPOSE: A flow control device for de-ionized water rinse is provided to improve the yield of wafer by preventing the de-ionized water from dropping on a wafer due to the such-back defect of a nozzle. CONSTITUTION: A nozzle part(10) jets de-ionized water on a wafer in order to remove a developing solution. A blocking part(11) opens/closes the hole of the nozzle part. A control part(12) controls open and close operation of the blocking part. A suction part(13) sucks the dropped de-ionized water after the de-ionized water jets on the wafer. A storage part(15) stores the de-ionized water which is drained through the suction part.
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