| 摘要 |
A solid bonding material (22) is placed on an electronic component (16). A heat conductive member (21) is superposed on the surface of the bonding material (22). A thermosetting adhesive (27, 28) of fluid state is interposed between the heat conductive member (21) and a substrate (15). The heat conductive member (21) is supported on the surface of the solid bonding material (22). The thickness of the bonding material (22) is maintained. When the bonding material (22) melts after the thermosetting adhesive (27, 28) has cured, the heat conductive member (21) is supported on the cured thermosetting adhesive (27, 28). The heat conductive member (21) is thus reliably prevented from a downward movement irrespective of the melting of the bonding material (22). The cured bonding material (22) is prevented from suffering from a reduction in the thickness. The thickness of the cured bonding material (22) can accurately be controlled based on the thickness of the solid bonding material (22). |
