| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing tape which allows a base film to be easily pulled out from an adhesive resin layer. SOLUTION: The three-layer-integrated laminated wafer processing tape includes a base film BTa having a release layer on its one surface, and a bonding agent layer BTb and an adhesive layer 22 on the other surface of the base film BTa. The adhesive layer is pasted on a wafer 10 having bump electrodes 10a. With the release layer provided, the adhesive is not transferred to the back face of the base film BTa when a rolled adhesive film is pulled out. COPYRIGHT: (C)2010,JPO&INPIT |
