| 摘要 |
PURPOSE: An apparatus and a method for cleaning a wafer are provided preventing the pressure change and the suction defect of nozzles by including an air-control valve and a solenoid valve which control a nozzle operation. CONSTITUTION: A deionized water line(31) is branched to a first deionized water line(31a) including a first air-control valve(50) and a second deionized water line(31b) including a second air-control valve(60). A first nozzle is installed on the end of the first deionized water line and sprays deionized water on the center part of a wafer. A second nozzle is installed on the end of the second deionized water line and sprays the deionized water on the edge part of the wafer. An air line(21) is branched to a first air line connected to the first air-control valve and a second air line connected to the second air-control valve. A solenoid valve(55) controls air which is supplied from an air supply unit.
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