PHOTOSENSITIVE ADHESIVE RESIN COMPOSITION, ADHESIVE FILM AND LIGHT-RECEIVING DEVICE

摘要

Disclosed is a photosensitive adhesive resin composition characterized by containing a compound (A) having a hydroxy group or carboxy group and a (meth)acryloyl group; a resin (B) thermosettingly reactive with the compound (A); a compound (C) having a (meth)acryloyl group but not having a hydroxy group and a carboxy group; a phenol resin or phenol (D); and a sensitizer (E). The photosensitive adhesive resin composition has excellent developability and is used for producing a spacer which is arranged between a transparent substrate and a substrate on which a semiconductor element is mounted. Also disclosed are an adhesive film produced by using the photosensitive adhesive resin composition, and a light-receiving device.