Land grid array package clamp mechanism

摘要

A Land Grid Array (LGA) clamp mechanism is presented. The mechanism includes a spring having a number of beams that mate with cooperating posts from a backing plate. The backing plate fits on the bottom side of a printed circuit board, opposite the area where a device is installed with the posts extending from the backing plate and through the printed circuit board. The LGA device is either inserted into a socket on the top side of the printed circuit board or mounted directly to the top side of the printed circuit board. A heat sink is placed directly on top of the LGA device. The posts from the backing plate extend through the circuit board and through the heatsink. A spring assembly is positioned along a top surface of the heatsink and is secured to the posts. The spring assembly includes a spring and a bias adjustment screw that is adjusted to provide a desired uniform amount of pressure to the heatsink, device and socket. Such a mechanism not only provides a uniform amount of pressure but also is additionally simple to install and adjust.