| 摘要 |
Provided are a package structure and a package substrate, including: a substrate body having a plurality of matrix-arranged electrical contact pads formed on at least one surface thereof, wherein a solder mask layer is formed on said surface and has a plurality of openings for exposing the electrical contact pads, respectively; a first electroless-plated layer disposed on the electrical contact pads, on the walls of the openings and at the peripheries of the openings; and a second electroless-plated layer disposed on the first electroless-plated layer, the first and second electroless-plated layers constituting a recessed electrical connection structure. By forming the even electroless-plated layers on the electrical contact pads. The invention overcomes drawbacks of the prior art, namely breakage of interfaces between solder bumps and electrical contact pads and even damage of the package structure otherwise caused by excessive differences in stress between the solder bumps.
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