| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce a trimming process cost of a semiconductor chip and to shorten the lead time of manufacturing. <P>SOLUTION: An electrode part and a wiring part on a surface of the semiconductor chip until trimming is photographed, in a duration from a die-bond curing process to a wire bond process of a package assembling process. Then, the electrical properties are measured, and the wiring to be trimmed is decided by referring to production information, and the wiring part at an opening part of a protective film is irradiated by a laser for laser trimming. Accordingly, there is no need to trim the entire wafer, and the cost is reduced. Furthermore, the lead time for product shipment becomes shortened. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
