USE OF HYBRID PCB MATERIALS IN PRINTED CIRCUIT BOARDS

摘要

A apparatus comprising a printed circuit board ('PCB'). The PCB comprises a first insulating layer and a second insulating layer. The first insulating layer is made of a first material and the second insulating layer is made of a second material. The first material has a lower dissipation factor than the second material. The first material and second material have substantially similar dielectric constants.