| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition for packaging a semiconductor, which excels in molding processability such as transfer moldability, and includes high light fastness and heat resistance. <P>SOLUTION: The resin composition comprising an organic compound having at least two carbon-carbon double bonds which includes reactivity with an SiH group in a molecule, a compound having at least two SiH groups in the molecule, and a hydrosilylating catalyst as indispensable constituents are used for packaging a semiconductor. <P>COPYRIGHT: (C)2010,JPO&INPIT |
